USB 3.0 Introduction

Intel Corporation (Intel) and industry-leading companies formed a working hand in hand with USB 3.0 Promotion Section, aimed at developing 10 times faster than today's super-efficient USB Internet technology. This technology is by Intel and Hewlett-Packard (HP), NEC, NXP Semiconductor and Texas Instruments (Texas Instruments) companies such as the joint development of applications including personal computers, mobile consumer products and the rapid synchronization instant transmission. With the growing popularity of digital media and the increasing transmission of documents - even more than 25 GB, rapid synchronization has become necessary to immediately transfer the performance needs.

USB 3.0 is backwards-compatible standards, both traditional and USB technology ease of use and plug-and-play functions. The technology goal is to launch than the current level of connecting more than 10 times faster products, USB cable and use the same framework. In addition to USB 3.0 specifications optimized to achieve lower power consumption and higher efficiency of the agreement, USB 3.0 port and cable to achieve backward compatibility, and support the future of optical fiber transmission.

"From a logical that the next generation USB 3.0 will become the most popular form of personal computers wired Internet," Intel's technology strategy division said Jeff Ravencraft, "the digital age need high-speed performance and reliability of the Internet in their daily lives to achieve the huge volume of data transmission . USB 3.0 can be very good response to this challenge and continue to provide users have been accustomed to and continue to look forward to the USB ease of use experience. "

Intel Corporation to promote the establishment of USB 3.0 on the beginning of hope that the USB Group Design Institute (USB-IF) can be used as USB 3.0 specifications of the trade associations. Integrity of the USB 3.0 specification is expected in the first half of 2008 launched, USB 3.0 will be used initially in the form of discrete silicon.

USB 3.0 Promotion Section, including Hewlett-Packard, Intel, NEC, NXP Semiconductor and Texas Instruments, already committed to the protection of USB device driver infrastructure and investment, USB and the appearance of the user-friendly features, while continuing to carry forward the technical excellence of this USB functions .

"We USB 2.0 and USB wireless technology support underlines HP committed to providing customers with reliable Internet peripherals way", the company responsible for printing and imaging market sector (Consumer Inkjet Solutions) vice president Phil Schultz said, "Now With USB 3.0, we will create, printers, digital cameras and other peripheral equipment and personal computers a better Internet experience. "

"Intel's two generations of USB technology in the development and use of areas in the industry taking the forefront, USB has now become the most popular handheld computing and electronic equipment external interface", Intel senior vice president and general manager of Digital Enterprise Group Pate Ji Singh (Patrick Gelsinger) said, "As the market for large customers to support the development of data storage and transmission needs, we hope to develop third-generation USB technology, we can use the existing USB interface and optimize them to meet these needs. "

"Since the first time since the USB cable installation, NEC has always been a supporter of USB technology", NEC Electronics general manager of SoC system Katsuhiko Itagaki said, "It is time for the further development of this has been the success of the Internet interface to meet the huge market for data transmission speed The higher demand, so as to shorten the waiting time for users. "

"NXP is very pleased to join hands with other top companies promoting the world's leading next-generation Internet technologies to meet the needs of peripheral equipment", NXP semiconductor business Internet Entertainment (Business Line Connected Entertainment) strategy and business development director Pierre-Yves Couteau said. " USB as a leading semiconductor solutions provider, NXP is committed to promoting the standardization of ultra-high-speed USB and applications. "

"With the high-speed USB in personal computing, consumer electronics and mobile market segments such as the universal, we expect will rapidly replace USB 3.0 ports USB2.0 high-bandwidth applications become the de facto standard," Texas Instruments vice president of Worldwide ASIC Greg Hantak, "said Texas Instruments is very excited about the outstanding performance of USB 3.0 will further expand the USB applications and to bring about a better user experience."

Design Institute on the USB (Universal Serial Bus Implementers Forum) Non-profit organizations USB Design Forum (USB-IF) for the purpose of the establishment of the USB technology development and universal support. Through its logo and certification programs, USB-IF for high-quality and compatibility of USB devices to assist the development of, USB-IF USB also vigorously propagate the advantages of its certification, as well as the quality of products.

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